1,4‑Dihydroxy‑2‑Butyne Plating Grade Collectibles: A Quiet Workhorse in Modern Electroplating

In the world of industrial chemcials, certain additives rarely make headlines yet consistently move the needle. 1,4‑Dihydroxy‑2‑butyne—often called 1,4‑butynediol—falls squarely into that camp. I’ve watched plating lines where a few ppm of the right diol additive smooths stress, sharpens grain, and frankly saves a production shift. That’s not hype; it’s shop-floor reality, as many customers say after a week of side-by-side runs.

Tenger Chemical’s 1,4‑Dihydroxy‑2‑Butyne Plating Grade Collectibles comes from their facility at 3-2-501, North Courtyard, West District, Jiuli Courtyard, Yuhua District, Shijiazhuang City, Hebei, China. Origin matters because consistent upstream control shows up in downstream stability—bath behavior, brightness windows, throw, you name it.

Why it’s trending in plating right now

Two big arcs: tighter tolerance parts (EV, aerospace, and connector miniaturization) and sustainability (lower rework, less metal waste). Additives like this diol help with finer leveling at lower doses, which, surprisingly, can reduce polish time and cut rejects. Also, I guess buyers notice the supplier’s REACH/RoHS posture more than they did a few years ago—compliance is table stakes now.

Typical product specs (plating grade)

Where it’s used

• Acid copper and copper alloy baths (leveling, grain refinement)
• Nickel and Ni alloy finishing (brightness extension with co-additives)
• Connector, PCB, lead frame, and decorative trim lines
• EV busbars, small motors, and aerospace fasteners (select lines)

Process flow and use

Materials: DI water, base metal salts, carriers/brighteners, and this diol. Methods: Dose at 5–50 mg/L start; maintain 2–10 mg/L via Hull cell or CVS feedback. Testing standards: ASTM B571 (adhesion), ISO 9227 (salt spray), ASTM B456/B633 (coating requirements). Service life: sealed shelf ≈ 12–24 months; in-bath effective window often 4–8 weeks before significant replenishment—depends on current density and drag-out.

Example test data (indicative): at 10 mg/L in acid Cu, labs reported 8–15% throwing power improvement and smoother Ra by ≈10–20% vs. baseline brightener alone. Your mileage will vary with anode condition and agitation, to be honest.

Vendor comparison (summary)

Customization and field notes

Tenger offers dosing guidance for different current-density ranges and can tailor packaging (HDPE 25 kg, 200 kg). One automotive connector plant told me their reject rate dropped “noticeably” after swapping in this grade—fewer nodules in low-current-density areas. Not a miracle cure, but it helped.

Case studies (condensed)

Case A: Acid copper on brass, high-throughput racks. With 12 mg/L diol, ASTM B571 adhesion passed across all racks; salt spray (ISO 9227) extended from 72 h to ≈96 h before first defect site.

Case B: Decorative Ni/Cr line. Diol plus existing brightener widened the “good brightness” window by ~10 A·min/L. Operators reported less babysitting—always nice on a Friday shift.

If you’re sourcing industrial chemcials for plating, watch not only purity but also moisture and batch-to-batch GC fingerprints. And, however obvious, validate at small scale first: Hull cell, CVS, then pilot paneling under ASTM/ISO protocols.

Compliance: ISO 9001 manufacturing; available statements for REACH and RoHS. Safe handling: standard chemical PPE; consult SDS; keep sealed and cool. Shipments are coordinated from Hebei with export docs prepared—simple, but it matters when timelines are tight.

References

1. ASTM B571: Adhesion of Metallic Coatings
2. ISO 9227: Corrosion tests in artificial atmospheres — Salt spray
3. ASTM B456: Copper + Nickel + Chromium Electrodeposits
4. ECHA Dossier: But-2-yne-1,4-diol (CAS 110‑65‑6)